Xilinx Quality & Reliability Programs
to view the PDF files below. Xilinx has complete capabilities to perform High Temperature Operating Life Test, Thermal Shock, Temperature Cycling, Biased Moisture Life Test, Unbiased Pressure Pot, Preconditioning, Solderability, and Hermeticity Testing (as well as a complete Failure Analysis Laboratory) in house. The following tables show the typical Xilinx qualification requirements for new and/or changed process flows:
In addition to qualifying new and/or changed processes, Xilinx has operated a reliability monitor program since 1989 which periodically samples all product families and all package families and verifies the reliability of these production products. Xilinx reliability engineering buys all of their monitor product samples directly from finished goods, thus sampling the same product distributions that are shipped to Xilinx customers. The results of this reliability monitor program, along with the qualification program mentioned above, are published in a quarterly report. The Historical Reliability Performance Chart shows the effect improvements in design and process technologies have had on the reliability of Xilinx products, as indicated by the results of operating life test for new products, and also for mature products. See the Quality Assurance Program Overview and the Quality Manual for additional information about the Xilinx Quality Assurance program. |