Packaging and Footprints

Application Notes

Application Briefs

to view the

PDF files below.

Application Notes

Title	Size
Common XC4000/XC5200 PC84 Footprint	50 KB
XC4010/XC4013 BG225 Pinout (Bottom View)	50 KB
XAPP074: Pin Preassigning with XC9500 CPLDs	50 KB

Application Briefs

Title	Size
XBRF002: Low Power Benefits of XC4000E/X: Overview	30 KB
XBRF004: PLDs, Pins, and PCBs: The Importance of Pin-Locking and Footprint Compatibility	50 KB
XBRF009: XC9500 Pin Locking Capability and Benchmarks	70 KB

Data Book

Title	Size
Packages and Thermal Characteristics	170 KB
Package Drawings	1.8 MB
Individual Package Drawings

Note: Other device pinouts are found in the individual data sheets

Xcell Articles

Title	Issue
Advanced Chip Scale & BGA Packaging	Q3 '99
New Chip Scale Packaging for Small, Lightweight Designs	Q4 '98
Chip-Scale Packaging: Ideally Suited to Today's Portable and Small Form-Factor Applications	Q3 '98
FPGAs, Power, and Packages	Q2 '97
Power, Package, and Performance: Trading Off Among the Three P's	Q3 '96

Other Links

Chip Scale Packaging

Xilinx Announces Most Advanced Chip Scale Packaging