Number |
Description |
Effective Date |
PCN97009A |
A reissue of a minor enhancement to the Xilinx line of thermally enhanced
quad flatpack (HQFP) packages. |
Oct 29, 1997 |
PDN97008A |
An update of PDN97008. New Last Time Buy and Last Time Delivery
dates. |
Apr 15, 1998 |
PDN97008 |
Discontinuance of the XC7000 Product Families (including XC7200 and
XC7300). |
Aug 01, 1997 |
PCN97007 |
Conversion of Xilinx MIL-STD-883 Military Products to QML. |
Apr 15, 1997 |
PDN97006 |
Withdrawal of certain specific low volume device/package
combinations. Note that no Xilinx military offerings are affected. (See
also XCU019701). |
Jan 30, 1997 |
PDN97005 |
Withdrawal of certain specific low volume device/package combinations.
Note that no Xilinx military offerings are affected. (See also XCU019701). |
Jan 30, 1997 |
PDN97004 |
Withdrawal of Commercial and Industrial XC3100A -5 Speed Grades, all
packages (note: Xilinx Military Products are not affected). (See also XCU019702). |
Jan 30, 1997 |
PDN97003 |
Withdrawal of Commercial and Industrial XC3000 -70 Speed
Grades, all packages (note: Xilinx Military Products are not affected).
(See also XCU019702). |
Jan 30, 1997 |
PCN97002 |
Additional Product Assembly Qualification of A.S.E. Taiwan. |
Feb 15, 1997 |
PCN97001 |
Qualification of ASTRA Microtronics Technology in Batam, Indonesia
as an assembly site for Xilinx PLCC packages. |
Feb 28, 1997 |