Xilinx: Quality & Reliability Programs

Xilinx Quality & Reliability Programs

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Xilinx has complete capabilities to perform High Temperature Operating Life Test, Thermal Shock, Temperature Cycling, Biased Moisture Life Test, Unbiased Pressure Pot, Preconditioning, Solderability, and Hermeticity Testing (as well as a complete Failure Analysis Laboratory) in house.

The following tables show the typical Xilinx qualification requirements for new and/or changed process flows:

Table 1A: Plastic Package/Product Qualification Requirements per Die Size
Table 2A: Plastic Package/Product Monitor Requirements and Test Conditions
Table 1B: Hermetic Package/Product Qualification Requirements per Die Size (Commercial)
Table 2B: Hermetic Package/Product Monitor Requirements and Test Conditions

The Failure Analysis Equipment List is a listing of Xilinx current failure analysis capabilities. Both of these laboratories are dedicated exclusively to increasing our customer's satisfaction through continuous improvements in our designs, processes and technologies.

In addition to qualifying new and/or changed processes, Xilinx has operated a reliability monitor program since 1989 which periodically samples all product families and all package families and verifies the reliability of these production products. Xilinx reliability engineering buys all of their monitor product samples directly from finished goods, thus sampling the same product distributions that are shipped to Xilinx customers. The results of this reliability monitor program, along with the qualification program mentioned above, are published in a quarterly report.

The Historical Reliability Performance chart shows the effect improvements in design and process technologies have had on the reliability of Xilinx products, as indicated by the results of operating life test.

See the Quality Assurance Program Overview for additional information about the program.