Packaging and Footprints 

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Application Notes  Application Briefs  Data Book

XCell Articles  Other Links

Application Notes

Title	Size
Footprint Compatibility Guide	260 KB
Common XC4000/XC5200 PC84 Footprint	50 KB
XC4010/XC4013 BG225 Pinout (Bottom View)	50 KB
XAPP074: Pin Preassigning with XC9500 CPLDs	50 KB

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Application Briefs

Title	Size
XBRF002: Low Power Benefits of XC4000E/X: Overview	30 KB
XBRF004: PLDs, Pins, and PCBs: The Importance of Pin-Locking and Footprint Compatibility	50 KB
XBRF009: XC9500 Pin Locking Capability and Benchmarks	70 KB

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Data Book

Title	Size
Packages and Thermal Characteristics	220 KB
Individual Package Drawings
XC4000E and XC4000X Series Pinouts	280 KB
XC4085XL Pinout Table Update	290 KB

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XCell Articles

Title	Issue
FPGAs, Power, and Packages	Q2 '97
Power, Package, and Performance: Trading Off Among the Three P's	Q3 '96

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Other Links

• Chip-Scale Packaging 
• Adapter and Socket Manufacturers
• Xilinx Device Package Files for use with the Development System
• Quality and Reliability
• QPRO Products for Aerospace, Defense, and High Reliability Markets