Packages and Thermal Characteristics 

Text Information
Individual Package Drawings
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The Packages and Thermal Characteristics chapter of the Data Book is quite large. To make the information more accessible on the Web, this page provides links to the text information only and individual package drawings. 

Text Information Only

pdf Packages and Thermal Characteristics - This document contains: 
  • Package Information
  • Thermal Management
  • Package Thermal Characterization Methods & Conditions
  • Power Management Options
  • Package Electrical Characterization
  • Component Mass by Package Type
  • Xilinx Thermally Enhanced Packaging
  • Moisture Sensitivity of PSMCs
  • Tape and Reel
  • Reflow Soldering Process Guidelines
  • Sockets
    •

     Individual Package Drawings

    Plastic DIP pdf PD8
    SOIC pdf SO8, VO8,  SO20,  SO24 ,  VO24 
    PLCC pdf PC20, PC28, PC44, PC68, PC84
    PQFP pdf PQ44, PQ160, PQ208, PQ240, HQ160, HQ208, HQ240, 
    pdf PQ100, HQ100 
    TQFP pdf TQ100, TQ144, TQ176, HT100, HT144, HT176
    pdf TQ128 , TQ160 
    VQFP pdf VQ44, VQ64, VQ100
    Chip Scale (CP) CP56 
    Chip Scale (CS) CS48,  CS144,  CS280
    BGA pdf BG225,  BG256, pdf BG352 , BG432 ,   BG560
    Ceramic PGA pdf PG68, PG84, pdf PG120, PG132, PG156, pdf PG175, pdf PG191, 
    pdf PG223 , PG299 ,  pdf PG411, 
    PG475, , PG559, 
    Ceramic Brazed QFP pdf CB100, CB164, CB196 (XC4000), pdf CB228
    Fine-Pitch BGA FG256,  FG456,  FG676  FG680,  FG860, ,
    FG900, , FG1156, , CG1156, 
    Plastic PGA pdf PP175
     
    To request a package drawing for a discontinued product, send a request to datasheet@xilinx.com
     

    		 
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